➀ Intel CEO Pat Gelsinger is leaving after three years; ➁ The U.S. imposes trade restrictions on 140 Chinese companies involved in technology trade; ➂ Anduril Industries wins a contract to modernize the U.S. Space Surveillance Network (SSN); ➃ BAE Systems plans to recruit over 2,400 staff in the UK; ➄ Microchip announces the closure of its Arizona wafer fabrication facility.
Recent #BAE Systems news in the semiconductor industry
➀ BAE Systems is recruiting for 2,400 jobs across the UK; ➁ Pat Gelsinger, CEO of Intel, is leaving the company; ➃ A space startup is delivering cargo to precise locations on Earth.
➀ Leonardo's ECRS Mk2 radar completed its first flight on a UK Typhoon test aircraft, marking a significant milestone in the development of the UK's Typhoon fighter jets. The radar, designed to enhance electronic warfare capabilities, is part of NATO's frontline fleet.
➁ The radar features a multi-functional array that can perform traditional radar functions and additional electronic warfare tasks.
➂ The ECRS Mk2 radar was developed in Edinburgh, with collaboration between the MoD, RAF, Leonardo UK, and BAE Systems.
1. BAE Systems and GlobalFoundries collaborate on secure chip fabrication for aerospace and defense. 2. Europe launches a pilot line for 10nm and 7nm FD-SOI ICs. 3. SiFive introduces its 4th generation RISC-V CPU cores. 4. A startup, Etched, develops AI chips faster than Nvidia's Blackwell. 5. The automotive semiconductor market shows signs of slowing down.
1. The global radiation-hardened chips market is projected to grow from $1,278.0 million in 2023 to $3,283.8 million by 2033, with a CAGR of 9.90%. 2. Key players driving market growth include BAE Systems, Honeywell International, Advanced Micro Devices, Microchip Technology, and Texas Instruments. 3. The report provides a detailed analysis of market trends, applications, products, and regional dynamics over the next decade.